Chip-to-chip interconnect integration technologies
نویسندگان
چکیده
منابع مشابه
Chip-to-chip interconnect integration technologies
With continuous increase in the off-chip bandwidth requirements, conventional interconnection methodologies are quickly becoming incapable of meeting the demand. Recent progress in silicon interposer and 3D integration technologies seek to alleviate some of these bottlenecks. This paper reviews the evolution of conventional interconnect methodologies and recent progress in platforms allowing hi...
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ژورنال
عنوان ژورنال: IEICE Electronics Express
سال: 2016
ISSN: 1349-2543
DOI: 10.1587/elex.13.20162001